Active Ingredients
Pyrithione zinc (0.9%)
Panthenol (0.5%)
Niacinamide (0.3%)
Salicylic Acid (0.01%)
The following Structured Product Label (SPL) was submitted to the FDA by A Joint-stock Corporation Gmc Holdings for the product Md Cell Scalp (NDC 70834-101). This document serves as the official prescribing information, containing essential scientific data and clinical materials required for healthcare providers and patients.
This specific version of the label includes detailed information regarding active ingredients, keep out of reach of children, uses, warnings, directions, inactive ingredients, md cell scalp shampoo, and other regulatory disclosures. Use the navigation below to review specific sections of the FDA submission.
Pyrithione zinc (0.9%)
Panthenol (0.5%)
Niacinamide (0.3%)
Salicylic Acid (0.01%)
Do not swallow. In case of accidental ingestion, get medical help or contact a Poison Control Center right away.
Helps prevent hair loss and thicken hair. Keeps scalp clean, healthy and smooth.
For external use only
Do not use on damaged or broken scalp
When using this product
- Avoid contact with eyes. If contact occurs, rinse eyes thoroughly with water.
Stop use and ask doctor if rash or irritation on scalp develops and lasts.
Store at room temperature
After wet hair with lukewarm water, apply the adequate amount on scalp and hair and massage gently until having foam enough. After 3 min, rinse with clean water.
Water, Sodium Laureth Sulfate, Ammonium Lauryl Sulfate, Cocamidopropyl Betaine, Glycerin, Polyquaternium-7, Dimethicone, Cocamide MEA, Sodium Benzoate, Cetrimonium Chloride, Phenoxyethanol, Guar Hydroxypropyltrimonium Chloride, Carbomer, Zinc Chloride, Disodium EDTA, Menthol, Biotin, Trideceth-10, Cocamide DEA , Sophora Angustifolia Root Extract, Glycyrrhiza Glabra (Licorice) Root Extract, Artemisia Princeps Leaf Extract, Coix Lacryma-Jobi Ma-yuen Seed Extract, Yeast Extract, Bifida Ferment Filtrate, rh-Oligopeptide-1, sh-Polypeptide-9, rh-Polypeptide-3, Copper Tripeptide-1, Citric Acid
* Please review the disclaimer below.